IC Backend Execution & Tapeout Delivery
Netlist-to-GDSII implementation with timing closure, DFT integration, and tapeout coordination across TSMC, Samsung, SMIC, UMC, and other major foundries.
Tapeout ownership from netlist handoff to foundry acceptance
3nm – 180nm · TSMC / Samsung / UMC / SMIC · Mixed-signal · Multi-domain · ECO-ready
Tapeout experience across TSMC, Samsung, UMC and SMIC
Execution Responsibility
We own backend execution and tapeout readiness as a single accountable team.
01 Implementation
Netlist handoff → signoff-ready GDSII
- Floor planning & power grid
- Place & Route execution
- Clock Tree Synthesis
- Multi-corner timing closure
02 Signoff
Verification → foundry submission readiness
- DRC/LVS closure
- IR/EM validation
- Multi-corner STA
- Physical verification signoff
03 Tapeout Coordination
GDS freeze → mask acceptance
- PDK compliance validation
- Foundry submission package
- MPW shuttle coordination
- GDS acceptance confirmation
Execution Record
8+
Tape-outs delivered
3nm–180nm
Node coverage
3+
Repeat clients
10–14 wk
Typical backend cycle
Representative Tapeout Work
- TSMC 28nm1.8M-instance mixed-signal SoC, 6 clock domains, 800MHz timing-critical SerDes interface, 45 signoff corners
- SMIC 55nmSensor AFE with embedded 12-bit ADC, OCV derating rebuild across analog/digital PVT corners, first-pass silicon
- UMC 110nmAnalog-dominant power management controller, full-custom analog block integration with digital wrapper
- SMIC 40nmIoT connectivity SoC, 3 independent voltage domains, UPF-based implementation with voltage-aware signoff
Where Teams Typically Break
- —Fragmented backend ownership
- —Timing closure pushed to late stage
- —Tapeout handled by third parties without context
- —ECO without physical awareness
We execute and own the full flow — from implementation through tapeout acceptance.
Case Study
SMIC 55nm — Sensor AFE with Embedded ADC
Delivered under tight schedule with first-pass silicon success
Situation
Mixed-signal AFE with embedded 12-bit ADC. Customer had exited a previous backend engagement after persistent timing failures across temperature corners and a failed first silicon attempt. Deadline to SMIC shuttle window: 9 weeks.
What we did
Identified timing violations rooted in insufficient OCV derating for mixed-signal paths. Rebuilt constraint set with separate PVT corners for analog and digital domains. Full incremental re-signoff after each ECO cycle. ICC package assembled and submitted ahead of shuttle window with a one-week buffer.
Outcome
First-pass silicon success. All analog performance targets met on silicon. Customer re-engaged for 28nm follow-on project.
Discuss Your Scope
Send node, schedule and scope. We review feasibility and return an execution plan within 48 hours.